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X13 Mainstream DP MB with 16DIMM DDR5, X710-AT2, AST2600

MBD-X13DEI-T-O
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kr 14 696,53 14696.53 NOK kr 14 696,53

kr 11 305,02

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    30-day money-back guarantee
    Shipping: 2-3 Business Days

    Summary Description

    The Supermicro MBD-X13DEI-T-O offers advanced performance and scalability with support for 5th/4th Gen Intel Xeon Scalable processors, up to 4TB ECC DDR5 memory, and extensive I/O options.

    Key Features

    • Support CXL
    • 5th/4th Gen Intel® Xeon® Scalable processors, Dual Socket LGA-4677 (Socket E) , CPU TDP supports up to 350W TDP
    • Intel® C741 Chipset
    • Up to 4TB 3DS ECC RDIMM, DDR5-5600MT/s in 16 DIMM slots
    • 4 PCIe 5.0 x16
    • 2 PCIe 5.0 x8
    • Broadcom BCM57416 Dual ports 10G LAN
    • 6 USB3.0 and 3 USB2.0
    • 2 SATA DOM ports
    • 2 M.2
    • 6 NVMe ports PCIe 5.0 x4 via 3 MCIO connectors
    • 8 SATA3.0 ports

    Key Applications

    • High-Performance Computing
    • Data Centers
    • Enterprise Servers
    • Virtualization
    • AI & Machine Learning
    • Big Data Analytics

    Description

    Supermicro's MBD-X13DEI-T-O is designed for high-performance computing. It supports dual socket LGA-4677 for 5th/4th Gen Intel Xeon Scalable processors with up to 350W TDP. This motherboard features the Intel C741 chipset, 16 DIMM slots for up to 4TB ECC DDR5 memory, and various expansion options including 4 PCIe 5.0 x16 slots, 6 NVMe ports, and dual 10G LAN. It also includes advanced management, health monitoring, and comprehensive I/O connectivity, making it ideal for demanding computing environments.

    Product Specifications

    Specification Details
    Product SKUs
    SKUs
    • MBD-X13DEI-T
    Physical Stats
    Form Factor
    • EATX
    Dimension
    • 12.1" x 13.05" (30.74cm x 33.15cm)
    Processor
    CPU
    • 5th Gen Intel® Xeon®/4th Gen Intel® Xeon® Scalable processors
    • Dual Socket V0 (LGA-4677) supported, CPU TDP supports Up to 350W TDP
    Core
    • Up to 64 cores
    System Memory
    Memory Capacity
    • 16 DIMM slots
    • Up to 4TB 3DS ECC RDIMM, DDR5-5600MT/s
    Memory Type
    • 5600/5200/4800/4400/4000 MT/s ECC DDR5 RDIMM (3DS) Up to 256GB of memory with speeds of up to 5600MT/s(1DPC)
    DIMM Sizes
    • 16GB, 32GB, 64GB, 96(XCC Only)GB, 128GB, 256GB
    • RDIMM: Up to 256GB
    Memory Voltage
    • 1.1V
    Error Detection
    • Corrects single-bit errors
    • Detects double-bit errors (using ECC memory)
    On-Board Devices
    Chipset
    • Intel® C741
    SATA
    • Intel® C741 controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10
    • Intel® C741 controller for 2 SATA3 (6 Gbps) ports; RAID 0,1
    IPMI
    • ASPEED AST2600 BMC
    Network Controllers
    • Dual LAN
    • Dual LAN with Broadcom BCM57416 10GBase-T
    Input / Output
    SATA
    • 8 SATA3 (6Gbps) port(s)
    • 2 SATA3 (6Gbps) port(s)
    LAN
    • 1 RJ45 Dedicated IPMI LAN port
    USB
    • 3 USB 2 port(s) (2 via header; 1 Type A)
    • 6 USB 3 port(s) (2 via header; 4 rear)
    Video Output
    • 1 VGA D-Sub Connector port(s)
    Serial Port
    • 2 COM Port(s) (1 header; 1 rear)
    TPM
    • 1 TPM Header
    Others
    • 3 MCIO PCIe 5.0 x8
    Expansion Slots
    PCIe
    • 2 PCIe 5.0 x8,
    • 4 PCIe 5.0 x16
    M.2
    • M.2 Interface: 2 PCIe 4.0 x2
    • Form Factor: 2280/22110
    • Key: M-Key
    System BIOS
    BIOS Type
    • AMI 32MB AMI UEFI
    BIOS Features
    • ACPI 6.4
    • SMBIOS 2.8/3.5
    • UEFI 2.8A
    • Plug and Play (PnP)
    • PCI FW 3.2
    Management
    Software
    • Redfish API,Supermicro Server Manager (SSM),Supermicro Power Manager (SPM),Supermicro Update Manager (SUM),Supermicro SuperDoctor® 5 (SD5),Super Diagnostics Offline (SDO),KVM with dedicated LAN,IPMI 2.0
    PC Health Monitoring
    Voltage
    • System temperature, PCH temperature, Memory temperature, CPU temperature, +5V standby, +5V, +3.3V, +12V, CPU thermal trip support, +3.3V standby, Veore, Vmem, Peripheral temperature, Platform Environment Control Interface (PECI)/(TSI)
    LED
    • UID/Remote UID
    • CPU / System Overheat LED
    Temperature
    • Monitoring for CPU and chassis environment
    • CPU thermal trip support
    • Thermal Monitor 2 (TM2) support
    • PECI
    FAN
    • 8x 4-pin fan headers (up to 8 fans)
    • Fan speed control
    • Overheat LED indication
    • 8x fans with tachometer monitoring
    Other Features
    • UID, Node Manager Support, M.2 NGFF connector, Control of power-on for recovery from AC power loss, Chassis intrusion detection, ACPI power management
    Operating Environment
    Operating Temperature Range
    • 10°C - 35°C (50°F - 95°F)
    Non-Operating Temperature Range
    • -40°C - 70°C (-40°F - 158°F)
    Operating Relative Humidity Range
    • 8% - 90% (non-condensing)
    Non Operating Relative Humidity Range
    • 5% - 95% (non-condensing)

    Standard Part List

    Part Number Quantity Description
    Bulk Package
    CPU carrier
    SKT-1333L-0000-FXC2CPU carrier for 4th Gen Intel® Xeon® Scalable processors (XCC)
    SKT-1424L-001B-LTS2CPU carrier for 4th Gen Intel® Xeon® Scalable processors (MCC)
    I/O Shield
    MCP-260-00042-3N1-
    SATA cable
    CBL-0044L257.5 cm SATA FLAT S-S PBF
    Retail Package
    CPU carrier
    SKT-1333L-0000-FXC2CPU carrier for 4th Gen Intel® Xeon® Scalable processors (XCC)
    SKT-1424L-001B-LTS2CPU carrier for 4th Gen Intel® Xeon® Scalable processors (MCC)
    I/O Shield
    MCP-260-00042-3N1-
    QRG
    MNL-2509-QRG1Motherboard Quick Reference Guide
    SATA cable
    CBL-0044L257.5 cm SATA FLAT S-S PBF

    Optional Part List

    Part Number Quantity Description
    TPM security module (optional, not included)
    AOM-TPM-9670V1SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
    AOM-TPM-9672V-FIPS1SPIcapable TPM 2.0 with Infineon 9672 controller with vertical form factor
    AOM-TPM-9672V1SPIcapable TPM 2.0 with Infineon 9672 controller with vertical form factor