Sapphire Rapids-SP (LGA-4677-E) SKT-E + EBG PCH, 8x DDR5

MBD-X13SEW-TF-B
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    Summary Description

    The Supermicro MBD-X13SEW-TF-B is a top-tier single socket motherboard designed for 5th and 4th Gen Intel Xeon Scalable processors. Featuring the Intel C741 Chipset, it supports up to 2TB ECC DDR5 memory across 8 DIMM slots. With robust connectivity options including 10 NVMe ports, dual 10GBase-T LAN, and comprehensive I/O interfaces, it is ideal for demanding server applications.

    Key Features

    • 5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket V0) supported, CPU TDP supports Up to 350W TDP
    • Intel C741® Chipset
    • Up to 2TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) in 8 DIMM slots
    • 1 PCIe 5.0 x8 ( in x16)1 PCIe 5.0 x32M.2 Interface:1 PCIe 3.0 x2M.2 Form Factor:2280, 22110M.2 Key:M-Key
    • 10 NVMe ports PCIe 5.0 x8 via 5 MCIO connectors
    • Dual LAN with 10GBase-T with Intel® X550
    • 2 SuperDOM with built-in power
    • I/O: 1 VGA, 2 COM, 1 TPM header
    • 4 USB 3.2 Gen1 (2 rear, 2 via header), 3 USB 2.0 (2 rear, 1 via Type-A)
    • Intel® C741 controller for 10 SATA3 (6 Gbps) ports

    Key Applications

    • High-performance computing
    • Data centers
    • Enterprise servers
    • Cloud computing
    • Virtualization

    Description

    The Supermicro MBD-X13SEW-TF-B motherboard brings high-performance capabilities with support for the 5th/4th Gen Intel Xeon Scalable processors in a single Socket LGA-4677 (Socket V0) platform. The board accommodates up to 2TB ECC DDR5-5600 memory in 8 DIMM slots. Key features include a PCIe 5.0 architecture, dual 10GBase-T LAN, and 10 NVMe ports via 5 MCIO connectors. It offers diverse I/O connectivity with both USB 3.2 Gen1 and USB 2.0 ports, as well as multiple expansion slots for M.2 and PCIe devices. The most recent BIOS provides compatibility with modern CPUs, supported by the Intel C741 chipset. With a range of advanced management features, robust health monitoring, and built-in security options, this motherboard is designed to meet the rigorous demands of today's data-centric environments.

    Product Specifications

    Specification Details
    Product SKUs
    SKUs
    • MBD-X13SEW-TF
    Physical Stats
    Form Factor
    • Proprietary WIO
    Dimension
    • 8" x 13" (20.32cm x 33.02cm)
    Processor
    CPU
    • 5th Gen Intel® Xeon®/4th Gen Intel® Xeon® Scalable processors
    • Single Socket E (LGA-1700) supported, CPU TDP supports Up to 350W TDP
    • *BIOS 2.1 or above is required to support 5th Gen Intel® Xeon® Scalable processors
    Core
    • Up to 64 cores
    System Memory
    Memory Capacity
    • 8 DIMM slots
    • Up to 2TB 3DS ECC RDIMM, DDR5-5600MT/s
    • **24GB & 48GB DIMM only support 1 DPC.
    • *24GB/48GB/96GB DDR5 DIMMs with 24Gb chip are only supported by 5th and 4th XCC Gen Intel® Xeon-SP CPU.
    Memory Type
    • 5600/5200/4800/4400/4000 MT/s ECC DDR5 RDIMM (3DS) Up to 256GB of memory with speeds of up to 5600MT/s(1DPC)
    DIMM Sizes
    • 16GB, 24GB, 32GB, 48GB, 64GB, 96GB, 128GB, 256GB
    Memory Voltage
    • 1.1V
    Error Detection
    • Corrects single-bit errors
    On-Board Devices
    Chipset
    • Intel® C741
    SATA
    • Intel® C741 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
    IPMI
    • ASPEED AST2600 BMC
    Graphics
    • 1 Aspeed AST2600 BMC port(s)
    Network Controllers
    • Dual LAN with 10GBase-T with Intel® X550
    Input / Output
    SATA
    • 10 SATA3 (6Gbps) port(s)
    LAN
    • 2 RJ45 10 Gigabit Ethernet LAN ports
    • 1 RJ45 Dedicated IPMI LAN port
    USB
    • 5 USB 2.0 port(s) (2 via header; 2 rear; 1 Type A)
    • 4 USB 3.2 Gen1 port(s) (2 via header; 2 rear)
    Video Output
    • 1 VGA D-Sub Connector port(s)
    Serial Port
    • 2 COM Port(s) (1 header; 1 rear)
    DOM
    • 2 SATADOM(Disk on Module) power connector support
    TPM
    • 1 TPM Header
    Expansion Slots
    PCIe
    • 1 PCIe 5.0 x8 Right Riser (in x16) slot,
    • 1 PCIe 5.0 x32 Left Riser Slot,
    • 5 PCIe 5.0 x8 PCIe5.0 MCIO connector
    M.2
    • M.2 Interface: 1 PCIe 3.0 x2
    • Form Factor: 2280/22110
    • Key: M-Key
    System BIOS
    BIOS Type
    • AMI UEFI
    BIOS Features
    • ACPI 6.4
    • SMBIOS 3.5
    • UEFI 2.8 or above
    Management
    Software
    • Redfish API,Supermicro Server Manager (SSM),Supermicro Power Manager (SPM),Supermicro Update Manager (SUM),Supermicro SuperDoctor® 5 (SD5),Super Diagnostics Offline (SDO),KVM with dedicated LAN,IPMI 2.0
    PC Health Monitoring
    Voltage
    • VBAT, System level control, Supports system management utility, Monitors CPU voltages, Chipset Voltage, Chassis intrusion header, 6 -fan status, +5V standby, +5V, +3.3V, +12V, Memory Voltages
    LED
    • UID/Remote UID
    • CPU / System Overheat LED
    Temperature
    • Monitoring for CPU and chassis environment
    • CPU thermal trip support
    • Thermal Monitor 2 (TM2) support
    • PECI
    FAN
    • 6x 4-pin fan headers (up to 6 fans)
    • Fan speed control
    • 6 fans with tachometer status monitoring
    • Overheat LED indication
    Other Features
    • WOL, UID, Node Manager Support, M.2 NGFF connector, Control of power-on for recovery from AC power loss, Chassis intrusion detection, ACPI power management

    Standard Part List

    Part Number Quantity Description
    Bulk Package
    CPU carrier
    SKT-1424L-001B-FXC1CPU carrier for 4th Gen Intel® Xeon® Scalable processors (MCC)
    SKT-1333L-0000-FXC1CPU carrier for 4th Gen Intel® Xeon® Scalable processors (XCC)
    SATA cable
    CBL-0044L257.5 cm SATA FLAT S-S PBF
    Retail Package
    CPU carrier
    SKT-1424L-001B-FXC1CPU carrier for 4th Gen Intel® Xeon® Scalable processors (MCC)
    SKT-1333L-0000-FXC1CPU carrier for 4th Gen Intel® Xeon® Scalable processors (XCC)
    QRG
    MNL-2413-QRG1Quick Reference Guide
    SATA cable
    CBL-0044L257.5 cm SATA FLAT S-S PBF

    Optional Part List

    Part Number Quantity Description
    TPM security module
    AOM-TPM-9670V1SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor