H12 AMD UP platform w.EPYC SP3 ROME CPU SoC,16 DIMM DDR4

MBD-H12SSW-INR-O
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kr 10,002.30 10002.300000000001 NOK kr 10,002.30

kr 7,694.08

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    30-day money-back guarantee
    Shipping: 2-3 Business Days

    Summary Description

    The Supermicro MBD-H12SSW-INR-O is a single socket motherboard designed to support AMD EPYC™ 7003/7002 series processors, providing up to 4TB DDR4 3200MHz memory, multiple expansion slots, and robust connectivity options. It offers exceptional performance and reliability, making it suitable for enterprise and data center environments.

    Key Features

    • Single AMD EPYC™ 7003/7002 Series Processor (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
    • 4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs
    • Expansion slots: 1 PCI-E 4.0 x32 Left Riser Slot 1 PCI-E 4.0 x16 Right Riser Slot M.2 Interface : 2 PCI-E 4.0 x2 M.2 Form Factor : 2280, 22110 M.2 Key : M-key
    • 12 native NVMe via SlimSAS, 4 NVMe or 16 SATA3 ports via SlimSAS, 2 M.2, 2 SATA3
    • Dual GbE LAN Ports via Broadcom BCM5720
    • ASPEED AST2500 BMC graphics
    • Up to 7 USB 3.0 ports
    • 6x 4-pin PWM Fans & Speed control

    Key Applications

    • Enterprise servers
    • Data centers
    • High-performance computing
    • Cloud infrastructure
    • Virtualization
    • Database management
    • Artificial intelligence
    • Machine learning

    Description

    The Supermicro MBD-H12SSW-INR-O motherboard supports single AMD EPYC™ 7003/7002 series processors, including the latest models with AMD 3D V-Cache™ Technology. It features up to 4TB of DDR4 3200MHz memory across 16 DIMM slots, extensive storage options with 12 native NVMe, 4 NVMe or 16 SATA3 ports via SlimSAS, and dual GbE LAN ports via Broadcom BCM5720. The board also includes ASPEED AST2500 BMC graphics, multiple USB 3.0 ports, and advanced IPMI support. Designed for high-performance computing, it ensures efficient and reliable operation in demanding environments.

    Product Specifications

    Specification Details
    Product SKUs
    MBD-H12SSW-iNR
    • H12SSW-iNR
    Physical Stats
    Form Factor
    • Proprietary
    Dimensions
    • 13.4" x 12.29" (34cm x 31.2cm)
    Processor/Chipset
    CPU
    • Single AMD EPYC™ 7003/7002 Series Processor(The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
    • Socket SP3
    Cores
    • Up to 64 Cores
    Chipset
    • System on Chip
    System Memory
    Memory Capacity
    • 16 DIMM slots
    • Supports up to 4TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs
    • 8-channel memory bus
    Memory Type
    • DDR4 3200 MHz Registered ECC, 288-pin gold-plated DIMMs
    DIMM Sizes
    • 8GB, 16GB, 32GB, 64GB, 128GB, 256GB
    Memory Voltage
    • 1.2V
    Error Detection
    • Corrects single-bit errors
    • Detects double-bit errors (using ECC memory)
    On-Board Devices
    SATA
    • SATA3 (6 Gbps)
    IPMI
    • Support for Intelligent Platform Management Interface v. 2.0
    • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
    • ASPEED AST2500 BMC
    Network Controllers
    • Dual GbE LAN Ports via Broadcom BCM5720
    • 1 Realtek RTL8211F PHY (dedicated IPMI)
    VGA
    • ASPEED AST2500 BMC
    Input / Output
    SATA
    • 2 SATA3 (6 Gbps) ports
    SATA/NVMe Hybrid
    • 16 SATA3 or 4 NVMe via SlimSAS (PCI-E Gen4)
    NVMe
    • 12 NVMe (PCI-E Gen4)
    LAN
    • 2 RJ45 GbE LAN ports
    • 1 RJ45 Dedicated IPMI LAN port
    USB
    • 7 USB 3.0 ports (4 rear, 2 via header, 1 Type A)
    VGA
    • 1 VGA port
    Others
    • 1 COM port
    • 2 SuperDOM power connectors
    • 1 TPM 1.2/2.0 header
    Expansion Slots
    PCI-Express
    • 1 PCI-E 4.0 x32 Left Riser Slot
    • 1 PCI-E 4.0 x16 Right Riser Slot
    M.2
    • Interface: 2 PCI-E 4.0 x2
    • Form Factor: 2280, 22110
    • Key: M-key
    Chassis (Optimized for H12SSW-iNR)
    1U
    • SC116AC10-R706WB3
    • SCLA15TQC-563W
    • SCLB16AC2-R504W
    2U
    • SC213BAC8-R1K23WB
    • SC825TQC-R802WB
    • SC826BAC4-R1K23WB
    System BIOS
    BIOS Type
    • AMI 256Mb SPI Flash EEPROM
    BIOS Features
    • Plug and Play (PnP)
    • DMI 2.3
    • PCI 2.2
    • ACPI 5.1
    • USB Keyboard Support
    • SMBIOS 3.1.1
    Management
    Software
    • Super Doctor 5
    • Watch Dog
    • NMI
    • SUM
    • IPMI 2.0 , KVM with dedicated LAN
    Power Configurations
    • ACPI Power Management
    • Power-on mode control for AC power loss recovery
    PC Health Monitoring
    CPU
    • Monitors CPU Core Voltages, +1.5V, +1.8V, +12V, +5V, +5V standby
    • CPU switching voltage regulator
    FAN
    • Up to 6 fan status tachometer monitoring
    • Up to 6 4-pin fan headers
    • Status monitor for speed control
    • Pulse Width Modulated (PWM) fan connectors
    Temperature
    • Monitoring for CPU and chassis environment
    • CPU Thermal Trip Support
    • Thermal control for 6x Fan connectors
    • I²C Temperature Sensing Logic
    LED
    • CPU / System Overheat LED
    Other Features
    • Chassis Intrusion Detection
    • Chassis Intrusion Header
    Operating Environment / Compliance
    Environmental Specifications
    • Operating Temperature:10°C to 35°C (50°F to 95°F)
    • Non-operating Temperature:-40°C to 70°C (-40°F to 158°F)
    • Operating Relative Humidity:8% to 90% (non-condensing)
    • Non-operating Relative Humidity:5% to 95% (non-condensing)

    Optional Part List

    Part Number Quantity Description
    Part NumberQtyDescription
    TPM security module
    AOM-TPM-9655V-TPM 1.2 module with Infineon 9655, RoHS/REACH,PBF;